The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Mar. 16, 2018
Applicant:
Lingsen Precision Industries, Ltd., Taichung, TW;
Inventors:
Ming-Te Tu, Taichung, TW;
Chiung-Yueh Tien, Taichung, TW;
Cheng-Yao Chang, Taichung, TW;
Mei-Yen Su, Taichung, TW;
Assignee:
LINGSEN PRECISION INDUSTRIES, LTD., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 19/14 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
G01L 19/143 (2013.01); G01L 19/0076 (2013.01); G01L 19/147 (2013.01);
Abstract
A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.