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2 inventors (with patents filed for the assignee):

Wei-Fan Chen (11 out of 46 patents)

Kuo-Chi Tsai (11 out of 11 patents)

11 patents: Sort by Forward Citations

1. 12442695 - Temperature sensing device (2025-10-14),

2. 12402390 - Method of manufacturing silicon carbide semiconductor power device (2025-08-26),

3. 12376331 - Semiconductor power device and method of manufacturing the same (2025-07-29),

4. 12341513 - Driving voltage generating device (2025-06-24),

5. 12191403 - Method of manufacturing merged PiN Schottky (MPS) diode (2025-01-07),

6. 12166082 - Silicon carbide semiconductor power transistor and method of manufacturing the same (2024-12-10),

7. 12154991 - Method of manufacturing wide-band gap semiconductor device (2024-11-26),

8. 12095254 - Electronic device and temperature detection device thereof (2024-09-17),

9. 12068742 - Short-circuit protection circuitry (2024-08-20),

10. 11990553 - Merged PiN Schottky (MPS) diode and method of manufacturing the same (2024-05-21),

11. 11955567 - Wide-band gap semiconductor device and method of manufacturing the same (2024-04-09),

Leap Semiconductor Corp. is a leading provider of high-performance analog and mixed-signal integrated circuits for a wide range of applications. Founded in 2010, the company focuses on delivering innovative solutions that enable customers to achieve superior performance and efficiency in their products. With a strong expertise in semiconductor design and manufacturing, Leap Semiconductor Corp. is committed to providing cutting-edge solutions to meet the evolving needs of the electronics industry.

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Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

11 Patents

#106 in Taoyuan

#1,273 in Taiwan

#50,241 in the World

Taoyuan, Taiwan

Leap Semiconductor Corp.

Forward Citations = 0

2 inventors:

Wei-Fan Chen (11 out of 46 patents)

Kuo-Chi Tsai (11 out of 11 patents)

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