Lbsemicon Co., Ltd.

Calculating rank

USPTO Granted Patents = 6

Forward Citations = 1

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5 inventors (with patents filed for the assignee):

Jae Jin Kwon (3 out of 3 patents)

Sang Hoon An (1 out of 1 patent)

Jin Kuk Lee (1 out of 15 patents)

4. Young Gu Kim (1 out of 63 patents)

5. Dong Hoon Lee (1 out of 33 patents)

6 patents: Sort by Forward Citations

1. 11664297 - Manufacturing method for reflowed solder balls and their under bump metallurgy structure (2023-05-30),

2. 11127658 - Manufacturing method for reflowed solder balls and their under bump metallurgy structure (2021-09-21),

3. 10937751 - Bump structure manufacturing method (2021-03-02),

4. 10825788 - Method for manufacturing compliant bump (2020-11-03),

5. 10784228 - Method of manufacturing semiconductor package using side molding (2020-09-22),

6. 10629444 - Method for manufacturing bump structure (2020-04-21),

Company Overview

Lbsemicon Co., Ltd. is a leading semiconductor manufacturer that specializes in the design and production of integrated circuits for various electronics applications. With a strong focus on innovation and quality, Lbsemicon aims to provide cutting-edge solutions to meet the evolving needs of the industry. From consumer electronics to industrial systems, Lbsemicon delivers reliable and high-performing semiconductor products to customers worldwide.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

6 Patents

#109 in Gyeonggi-do

#1,621 in South Korea

Gyeonggi-do, South Korea

Lbsemicon Co., Ltd.

Forward Citations = 1

5 inventors:

Jae Jin Kwon (3 out of 3 patents)

Sang Hoon An (1 out of 1 patent)

Jin Kuk Lee (1 out of 15 patents)

4. Young Gu Kim (1 out of 63 patents)

5. Dong Hoon Lee (1 out of 33 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Lbsemicon Co., Ltd.. Retrieved from https://idiyas.com/company/lbsemicon-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]