Forward Citations = 1

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5 inventors (with patents filed for the assignee):

Jae Jin Kwon (3 out of 3 patents)

Sang Hoon An (1 out of 1 patent)

Jin Kuk Lee (1 out of 15 patents)

4. Young Gu Kim (1 out of 63 patents)

5. Dong Hoon Lee (1 out of 33 patents)

6 patents: Sort by Forward Citations

1. 11664297 - Manufacturing method for reflowed solder balls and their under bump metallurgy structure (2023-05-30),

2. 11127658 - Manufacturing method for reflowed solder balls and their under bump metallurgy structure (2021-09-21),

3. 10937751 - Bump structure manufacturing method (2021-03-02),

4. 10825788 - Method for manufacturing compliant bump (2020-11-03),

5. 10784228 - Method of manufacturing semiconductor package using side molding (2020-09-22),

6. 10629444 - Method for manufacturing bump structure (2020-04-21),

Lbsemicon Co., Ltd. is a leading semiconductor manufacturer that specializes in the design and production of integrated circuits for various electronics applications. With a strong focus on innovation and quality, Lbsemicon aims to provide cutting-edge solutions to meet the evolving needs of the industry. From consumer electronics to industrial systems, Lbsemicon delivers reliable and high-performing semiconductor products to customers worldwide.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

6 Patents

#109 in Gyeonggi-do

#1,615 in South Korea

Gyeonggi-do, South Korea

Lbsemicon Co., Ltd.