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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629444 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Jun. 09, 2016

Method for manufacturing bump structure

Applicant:

Lbsemicon Co., Ltd., Gyeonggi-do, KR;

Inventor:

Young Gu Kim, Gyeonggi-do, KR;

Assignee:

LBSEMICON CO., LTD., Gyeonggi-Do, KR;

Attorneys:

Stuart H. Mayer

Mayer & Willams PC

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
H01L 21/288 (2006.01); H01L 23/488 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); C23C 18/16 (2006.01); H01L 23/00 (2006.01); C25D 5/12 (2006.01); C25D 3/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C23C 18/1633 (2013.01); C25D 3/48 (2013.01); C25D 5/12 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); H01L 23/00 (2013.01); H01L 23/488 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/11 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/94 (2013.01);
Abstract

The present invention relates to a method for manufacturing a bump structure capable of enhancing adhesion, comprising the steps of: forming an under bump metal (UBM) layer on a conductive pad; forming a copper bump on the UBM layer by electrolytic plating; forming a nickel bump on the copper bump by electrolytic plating; forming a first gold bump on the nickel bump by electrolytic plating using a first gold plating solution; and forming a second gold bump on the first gold bump by electrolytic plating using a second gold plating solution, wherein the second gold plating solution contains thallium (Tl) and the first gold plating solution is free of thallium.

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