The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Dec. 06, 2018
Lbsemicon Co., Ltd., Gyeonggi-do, KR;
Do Hyung Kim, Gyeonggi-do, KR;
Sang Hoon An, Gyeonggi-do, KR;
LBSEMICON CO., LTD., Gyeonggi-Do, KR;
Abstract
Provided is a method of manufacturing a semiconductor package, the method including forming sawing grooves by sawing a wafer along individual chip boundaries in a downward direction from a top surface of the wafer by a thickness less than a wafer thickness, filling the sawing grooves with a molding material, forming a redistribution pattern, a passivation pattern, and an under bump metal (UBM) pattern on the wafer, bonding solder balls onto the UBM pattern, thinning the wafer based on a backgrinding process, and dividing the wafer into individual chips by sawing the molding material filled in the sawing grooves, in a downward direction.