Gyeonggi-do, South Korea

Dong Hoon Lee

This inventor holds 33 USPTO granted patents and 35 published patent applications, plus 1 CIPO patent and 14 EPO patents, primarily in Semiconductor Packaging. Top assignees: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology, Inc., Samsung Electronics Co., Ltd.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong Hoon Lee. Retrieved from https://idiyas.com/inventor/dong-hoon-lee-8huziggw

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 33 

% Patents Active = 97.0


 

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 118(Granted Patents)


Location History:

  • Incheon, KR (2014)
  • Gyeonggi-do, KR (2004 - 2024)
  • Suwon-si, KR (2024)

Company Filing History:


Years Active: 2004-2026

Loading Chart...
Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Device
Camera Module
Data Storage
Sensor Actuator
Memory Controller
Tilt Seat Cushion
LED Package
Ventilation Seat
Ice Making Apparatus
Shock Absorber Device
Heat Sink Support
33 patents (USPTO):Explore Patents

Title: **Innovations of Dong Hoon Lee: A Pioneer in Semiconductor Technology**

Introduction

Dong Hoon Lee, a notable inventor based in Gyeonggi-do, South Korea, has made significant contributions to the field of semiconductor technology. With 19 patents to his name, his innovative work continues to impact the electronics industry, enhancing the performance and efficiency of semiconductor devices.

Latest Patents

One of Dong Hoon Lee's latest patents is a groundbreaking semiconductor package utilizing a coreless signal distribution structure (CSDS). This invention includes a CSDS that comprises at least one dielectric layer and at least one conductive layer. It features a first surface and a second surface that is opposite the first surface. The design incorporates a first semiconductor die with a bond pad on a first die surface, which is bonded to the first surface of the CSDS. Additionally, a second semiconductor die is incorporated with its own bond pad, bonded to the opposite surface of the CSDS. Further enhancing this design is a metal post electrically coupled to the first surface of the CSDS, along with an encapsulant material that protects crucial components, ensuring durability and performance of the semiconductor package.

Career Highlights

Dong Hoon Lee's journey in the semiconductor industry includes tenure at prestigious companies such as Amkor Technology, Inc. and Samsung Electronics Co., Ltd. These experiences have allowed him to spearhead innovative projects and contribute to advancements in technology that often define market trends.

Collaborations

Throughout his career, Dong Hoon Lee has collaborated with esteemed colleagues, including Seung Chul Han and Jung Park. Together, they have worked on numerous projects that have significantly advanced the field of semiconductor engineering.

Conclusion

Dong Hoon Lee is an influential figure in semiconductor innovation. With a remarkable portfolio of patents and valuable industry experience, he continues to shape the future of technology. His latest inventions not only reflect his technical expertise but also his commitment to improving the functionality and reliability of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…