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Simpsonville, SC, United States of America

Kemet Electronics Corporation

USPTO Granted Patents = 302

% Expired Patents = 26.2

EPO Patents = 29

Trademarks = 6

Forward Citations = 2,629

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189 inventors (with patents filed for the assignee):

Philip Michael Lessner (80 out of 82 patents)

John Tony Kinard (72 out of 77 patents)

Brian John Melody (62 out of 68 patents)

4. Antony P Chacko (61 out of 62 patents)

5. John Bultitude (52 out of 58 patents)

6. David Alexander Wheeler (34 out of 35 patents)

7. Randolph Stephen Hahn (34 out of 34 patents)

8. Qingping Chen (33 out of 38 patents)

9. John E McConnell (30 out of 30 patents)

10. Yaru Shi (29 out of 29 patents)

11. Lonnie G Jones (22 out of 22 patents)

12. Jeffrey Poltorak (22 out of 22 patents)

13. Yongjian Qiu (19 out of 24 patents)

14. Albert Kennedy Harrington (19 out of 19 patents)

15. John D Prymak (18 out of 21 patents)

Core Competencies:

Multilayer Ceramic Capacitor

Solid Electrolytic Capacitor

Polymer Dispersion

High Power Capacitors

Hermetic Packaging

Capacitor Anode

Dielectric Composition

ESD Suppression

Conductive Polymer

Capacitor Manufacturing

Thermal Performance

High Density Electronics

302 patents: Sort by Forward Citations

1. 12700549 - Capacitor and process for forming electrical connections therein (2026-08-04),

2. 12592346 - Monolithic multilayered ceramic capacitor (2026-03-31),

3. 12500045 - Capacitor and method of its manufacturing based on oxidative polymerization dispersion (2025-12-16),

4. 12482610 - Method of producing a tantalum capacitor anode (2025-11-25),

5. 12249463 - Multi-terminal MLCC for improved heat dissipation (2025-03-11),

6. 12230454 - Method of forming a polymer dispersion (2025-02-18),

7. 12205775 - Process to improve coverage and electrical performance of solid electrolytic capacitors (2025-01-21),

8. 12040135 - Resonant multilayer ceramic capacitors (2024-07-16),

9. 11943869 - Electrically functional circuit board core material (2024-03-26),

10. 11935708 - Solid electrolytic capacitor with improved reliability (2024-03-19),

11. 11935705 - Advanced polymer dispersion and a capacitor on its base (2024-03-19),

12. 11935699 - Overmolded film capacitor (2024-03-19),

13. 11935698 - Dielectric ceramic composition and multi-layered ceramic capacitor comprised thereof (2024-03-19),

14. 11929215 - Wire to anode connection (2024-03-12),

15. 11923151 - Structural lead frame (2024-03-05),

Company Overview

Kemet Electronics Corporation, headquartered in Simpsonville, SC, specializes in the development and manufacturing of advanced ceramic capacitors. The company focuses on a range of core technologies including multilayer ceramic capacitors, solid electrolytic capacitors, and high power capacitors. Kemet is known for its innovations in polymer dispersion, hermetic packaging, and dielectric composition, catering to diverse applications such as ESD suppression. Their expertise positions them as a key player in the electronics industry, addressing the evolving needs of modern technology.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

302 Patents

#1 in Simpsonville, SC

#13 in South Carolina

#1,451 in US

#2,962 in the World

Simpsonville, SC, United States of America

Kemet Electronics Corporation

Forward Citations = 2,629

189 inventors:

Philip Michael Lessner (80 out of 82 patents)

John Tony Kinard (72 out of 77 patents)

Brian John Melody (62 out of 68 patents)

4. Antony P Chacko (61 out of 62 patents)

5. John Bultitude (52 out of 58 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Kemet Electronics Corporation. Retrieved from https://idiyas.com/company/kemet-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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