The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Mar. 31, 2022
Applicant:

Kemet Electronics Corporation, Fort Lauderdale, FL (US);

Inventors:

Evangelista Boni, Sasso Marconi, IT;

Federico Fantini, Sasso Marcono, IT;

Gabriele Piccinini, Sasso Marcono, IT;

Walter Bruno, Sasso Marcono, IT;

Assignee:

KEMET Electronics Corporation, Fort Lauderdale, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 2/10 (2006.01); H01G 4/32 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 2/10 (2013.01); H01G 4/32 (2013.01);
Abstract

Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.


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