The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Aug. 11, 2021
Applicant:

Kemet Electronics Corporation, Fort Lauderdale, FL (US);

Inventors:

Christian L. Guerrero, Simpsonville, SC (US);

Jeffrey Poltorak, Simpsonville, SC (US);

Yuri Freeman, Simpsonville, SC (US);

Steve C. Hussey, Simpsonville, SC (US);

Chris Stolarski, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Fort Lauderdale, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/052 (2006.01); H01G 9/00 (2006.01); H01G 9/008 (2006.01); H01G 9/012 (2006.01); H01G 9/042 (2006.01);
U.S. Cl.
CPC ...
H01G 9/0525 (2013.01); H01G 9/0029 (2013.01); H01G 9/008 (2013.01); H01G 9/012 (2013.01); H01G 9/042 (2013.01); H01G 9/052 (2013.01);
Abstract

An improved capacitor is provided wherein the capacitor has an improved bond between the anode and anode wire. The anode comprises a pressed anode powder comprising a first density region and a second density region wherein the second density region has a higher density than the first density region. An anode wire extends into the second density region wherein the anode wire in the second density region is distorted by compression. This allows for better utilization of the metal powder surface area by allowing a lower bulk press density and lower sinter temperature while still achieving the necessary wire pull strength. In addition, this invention when utilized with deoxidation steps, results in sufficient wire pull strengths not possible otherwise.


Find Patent Forward Citations

Loading…