The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Apr. 19, 2021
Applicant:

Kemet Electronics Corporation, Fort Lauderdale, FL (US);

Inventors:

Mark R. Laps, Simpsonville, SC (US);

John Bultitude, Simpsonville, SC (US);

Philip M. Lessner, Simpsonville, SC (US);

Lonnie G. Jones, Simpsonville, SC (US);

Allen Templeton, Simpsonville, SC (US);

Nathan A. Reed, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Fort Lauderdale, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/258 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01);
U.S. Cl.
CPC ...
H01G 4/258 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01);
Abstract

Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.


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