For the Inventor, By the Inventor

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San Diego, CA, United States of America

Incep Technologies, Inc.

USPTO Granted Patents = 16

% Expired Patents = 6.3

Forward Citations = 495

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13 inventors (with patents filed for the assignee):

Joseph Ted Dibene, Ii (14 out of 17 patents)

David H Hartke (11 out of 14 patents)

Edward J Derian (5 out of 8 patents)

4. Carl E Hoge (4 out of 6 patents)

5. James M Broder (2 out of 2 patents)

6. Farhad Raiszadeh (2 out of 2 patents)

7. J Ted DiBene, Ii (1 out of 1 patent)

8. David J Hartke (1 out of 1 patent)

9. Philip M Harris (1 out of 5 patents)

10. Joseph S Riel (1 out of 1 patent)

11. Jose B San Andres (1 out of 1 patent)

12. James Hjerpe Kaskade (1 out of 1 patent)

13. Joseph T DiBene (1 out of 7 patents)

16 patents: Sort by Forward Citations

1. 6947293 - Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management (2005-09-20),

2. 6847529 - Ultra-low impedance power interconnection system for electronic packages (2005-01-25),

3. 6845013 - Right-angle power interconnect electronic packaging assembly (2005-01-18),

4. 6801431 - Integrated power delivery and cooling system for high power microprocessors (2004-10-05),

5. 6754086 - Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive (2004-06-22),

6. 6741480 - Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems (2004-05-25),

7. 6698511 - Vortex heatsink for high performance thermal applications (2004-03-02),

8. 6623279 - Separable power delivery connector (2003-09-23),

9. 6618268 - Apparatus for delivering power to high performance electronic assemblies (2003-09-09),

10. 6609914 - High speed and density circular connector for board-to-board interconnection systems (2003-08-26),

11. 6556455 - Ultra-low impedance power interconnection system for electronic packages (2003-04-29),

12. 6490160 - Vapor chamber with integrated pin array (2002-12-03),

13. 6452804 - Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate (2002-09-17),

14. 6452113 - Apparatus for providing power to a microprocessor with integrated thermal and EMI management (2002-09-17),

15. 6356448 - Inter-circuit encapsulated packaging for power delivery (2002-03-12),

INCEP Technologies, Inc. is a leading provider of advanced technology solutions for businesses. We specialize in software development, cybersecurity, big data analytics, and cloud computing. Our innovative products and services help companies streamline their operations, enhance security, and drive growth. With a team of highly skilled professionals, we deliver cutting-edge technology solutions tailored to meet the unique needs of our clients. Visit our website to learn more about our offerings and how we can help your business thrive in the digital age.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

16 Patents

#361 in San Diego, CA

#4,767 in California

#19,898 in US

#37,766 in the World

San Diego, CA, United States of America

Incep Technologies, Inc.

Forward Citations = 495

13 inventors:

Joseph Ted Dibene, Ii (14 out of 17 patents)

David H Hartke (11 out of 14 patents)

Edward J Derian (5 out of 8 patents)

4. Carl E Hoge (4 out of 6 patents)

5. James M Broder (2 out of 2 patents)

Please report any incorrect information to [email protected]

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