For the Inventor, By the Inventor

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San Diego, CA, United States of America

Incep Technologies, Inc.

USPTO Granted Patents = 16

% Expired Patents = 6.3

Forward Citations = 495

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13 inventors (with patents filed for the assignee):

Joseph Ted Dibene, Ii (14 out of 17 patents)

David H Hartke (11 out of 14 patents)

Edward J Derian (5 out of 8 patents)

4. Carl E Hoge (4 out of 6 patents)

5. James M Broder (2 out of 2 patents)

6. Farhad Raiszadeh (2 out of 2 patents)

7. J Ted DiBene, Ii (1 out of 1 patent)

8. David J Hartke (1 out of 1 patent)

9. Philip M Harris (1 out of 5 patents)

10. Joseph S Riel (1 out of 1 patent)

11. Jose B San Andres (1 out of 1 patent)

12. James Hjerpe Kaskade (1 out of 1 patent)

13. Joseph T DiBene (1 out of 7 patents)

16 patents: Sort by Forward Citations

1. 6947293 - Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management (2005-09-20),

2. 6847529 - Ultra-low impedance power interconnection system for electronic packages (2005-01-25),

3. 6845013 - Right-angle power interconnect electronic packaging assembly (2005-01-18),

4. 6801431 - Integrated power delivery and cooling system for high power microprocessors (2004-10-05),

5. 6754086 - Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive (2004-06-22),

6. 6741480 - Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems (2004-05-25),

7. 6698511 - Vortex heatsink for high performance thermal applications (2004-03-02),

8. 6623279 - Separable power delivery connector (2003-09-23),

9. 6618268 - Apparatus for delivering power to high performance electronic assemblies (2003-09-09),

10. 6609914 - High speed and density circular connector for board-to-board interconnection systems (2003-08-26),

11. 6556455 - Ultra-low impedance power interconnection system for electronic packages (2003-04-29),

12. 6490160 - Vapor chamber with integrated pin array (2002-12-03),

13. 6452804 - Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate (2002-09-17),

14. 6452113 - Apparatus for providing power to a microprocessor with integrated thermal and EMI management (2002-09-17),

15. 6356448 - Inter-circuit encapsulated packaging for power delivery (2002-03-12),

Company Overview

Incep Technologies, Inc. is a San Diego-based company specializing in advanced technology solutions across various sectors. The organization focuses on developing innovative software and hardware products that enhance operational efficiency and drive digital transformation. With a strong emphasis on research and development, Incep Technologies is dedicated to pushing the boundaries of technology in fields such as cloud computing, artificial intelligence, and data analytics, positioning itself as a key player in the tech landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

16 Patents

#361 in San Diego, CA

#4,777 in California

#19,935 in US

#37,868 in the World

San Diego, CA, United States of America

Incep Technologies, Inc.

Forward Citations = 495

13 inventors:

Joseph Ted Dibene, Ii (14 out of 17 patents)

David H Hartke (11 out of 14 patents)

Edward J Derian (5 out of 8 patents)

4. Carl E Hoge (4 out of 6 patents)

5. James M Broder (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Incep Technologies, Inc.. Retrieved from https://idiyas.com/company/incep-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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