Oceanside, CA, United States of America

Joseph T DiBene


Average Co-Inventor Count = 1.7

ph-index = 6

Forward Citations = 98(Granted Patents)


Company Filing History:


Years Active: 1998-2007

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7 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Joseph T DiBene

Introduction

Joseph T DiBene is a notable inventor based in Oceanside, California, with a remarkable portfolio of seven patents. His work primarily focuses on advancements in microprocessor technology, particularly in power management and thermal management systems.

Latest Patents

Among his latest patents is a method and apparatus for providing power to a microprocessor with integrated thermal and EMI management. This innovative microprocessor packaging architecture utilizes a modular circuit board assembly that effectively supplies power while managing thermal and electromagnetic interference. The assembly consists of a substrate with a mounted component, a circuit board designed to supply power, and conductive interconnect devices that electrically couple the circuit to the component. Another significant patent involves micro-spring interconnect systems for low impedance high power applications. This assembly features a microprocessor connected to a power conversion assembly through a compliant conductor assembly, which includes multiple spring conductors that provide various conductive paths.

Career Highlights

Throughout his career, Joseph has worked with prominent companies, including NCR Corporation. His contributions have significantly impacted the field of microprocessor technology, showcasing his expertise and innovative spirit.

Collaborations

Joseph has collaborated with notable individuals such as David H Hartke and James J Hjerpe Kaskade. These partnerships have further enriched his work and expanded the scope of his inventions.

Conclusion

Joseph T DiBene's contributions to microprocessor technology through his patents and collaborations highlight his role as a significant innovator in the field. His work continues to influence advancements in power management and thermal solutions for electronic systems.

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