Ncr Corporation

Other

Incep Technologies, Inc.

Joseph T DiBene

David H Hartke

P Keith Muller

Edward J Derian

Carl E Hoge

Philip M Harris

Irving M Robinson

James J Hjerpe Kaskade

A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management

An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.

Micro-spring interconnect systems for low impedance high power applications

A synchronous voltage regulation circuit having an energy storage circuit for controlling the output signal is disclosed. The voltage regulation circuit includes a circuit which advantageously uses leakage inductance from loose coupling of input and output inductors to control regulator switching.

Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive

A printed circuit board with an imbedded electrical component, comprising three layers. The first and second layers are coupled together, and an area of the second layer of the printed circuit board is selectively removed to expose a portion of the first layer of the printed circuit board. The opening accepts an electrical component that is mounted to the first layer of the printed circuit board within the selectively removed area of the second layer of the printed circuit board. The third layer of the printed circuit board is coupled to the second layer of the printed circuit board, at least partially covers the selectively removed area of the second layer of the printed circuit board, and at least partially covers the mounted component within the selectively removed area of the second layer of the printed circuit board.

Imbedded die-scale interconnect for ultra-high speed digital communications

A method and apparatus for coupling high speed data components using imbedded PCB AC coupling capacitors is disclosed. The capacitor comprises a first and a second conductive plate of polygonal shape coupled to surrounding circuitry at the polygonal vertices of the polygonal plates. This configuration results in improved capacitor performance, particularly with respect to capacitive impedance and reflected waves for high bandwidth signals at the frequency ranges of interest.

Imbedded PCB AC coupling capacitors for high data rate signal transfer

A Pulse Amplitude Modulation (PAM) generator that generates multilevel PAM signals at frequencies over 1 GHz is disclosed. The PAM generator uses Emitter Coupled Logic (ECL) technology that implements differential pair current switches such that the outputs are summed to produce precisely balanced PAM signals.

ECL pulse amplitude modulated encoder driver circuit

High pressure jackscrew connectors for removably attaching a first component to a second component having an internally threaded member. One preferred embodiment described includes a panel mount member which is attached to the first component to be joined. When attached to the first component, the panel mount member retains an internally threaded ejector member. A pressure inserter member having a longitudinally extending externally threaded portion engages with the internal threads of the ejector member and the internal threaded member of the second component to pull the ejector member towards the pressure inserter member and push the first component towards the second component upon rotation of the pressure inserter member. These high pressure jackscrew connectors are suitable for use in removably attaching printed circuit boards, particularly those utilizing high-density connectors which generally require greater insertion and extraction forces, and other components in and to electrical apparatus enclosures, chassis and other structural members.

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Oceanside, CA, United States of America

Joseph T DiBene