The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Mar. 04, 2003
Applicants:
David H. Hartke, Durango, AZ (US);
J. Ted Dibene, Ii, Oceanside, CA (US);
Inventors:
David H. Hartke, Durango, AZ (US);
J. Ted DiBene, II, Oceanside, CA (US);
Assignee:
Incep Technologies, Inc., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 720 ;
U.S. Cl.
CPC ...
Abstract
The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.
Hartke, David. (2005). Right-angle power interconnect electronic packaging assembly (U.S. Patent No. 6845013). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6845013
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile