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For the Inventor, By the Inventor

Durango, CO, United States of America

David H Hartke

This inventor holds 14 USPTO granted patents and 1 published patent application. Top assignees: Incep Technologies, Inc., Molex Corporation, Ncr Corporation. Active years: 1999-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David H Hartke. Retrieved from https://idiyas.com/inventor/david-h-hartke

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 78.6

Average Co-Inventor Count = 2.7

ph-index = 12

Forward Citations = 511(Granted Patents)


Location History:

  • Lake Havasu, AZ (US) (2004)
  • Durango, AZ (US) (2005)
  • Lake Havasu City, AZ (US) (2007)
  • Durango, CO (US) (1999 - 2011)

Company Filing History:

goldMedal11 out of 16 
 
Incep Technologies, Inc.
 patents
silverMedal1 out of 3,087 
 
Molex Corporation
 patents
bronzeMedal1 out of 4,492 
 
Ncr Corporation
 patents
4. 1 out of 834,453 
Other
 patents

Years Active: 1999-2011

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14 patents (USPTO):Explore Patents
1. 7881072 - System and method for processor power delivery and thermal management (2011-02-01),
2. 7245507 - Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management (2007-07-17),
3. 6947293 - Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management (2005-09-20),
4. 6847529 - Ultra-low impedance power interconnection system for electronic packages (2005-01-25),
5. 6845013 - Right-angle power interconnect electronic packaging assembly (2005-01-18),
6. 6741480 - Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems (2004-05-25),
7. 6623279 - Separable power delivery connector (2003-09-23),
8. 6618268 - Apparatus for delivering power to high performance electronic assemblies (2003-09-09),
9. 6556455 - Ultra-low impedance power interconnection system for electronic packages (2003-04-29),
10. 6452804 - Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate (2002-09-17),
11. 6452113 - Apparatus for providing power to a microprocessor with integrated thermal and EMI management (2002-09-17),
12. 6356448 - Inter-circuit encapsulated packaging for power delivery (2002-03-12),
13. 6304450 - Inter-circuit encapsulated packaging (2001-10-16),
14. 5969579 - ECL pulse amplitude modulated encoder driver circuit (1999-10-19),

Title: The Innovative Journey of David H Hartke

Introduction: David H Hartke, a talented inventor based in Durango, CO (US), has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: David H Hartke's latest patents include cutting-edge solutions in renewable energy technology, advanced materials science, and sustainable agriculture practices.

Career Highlights: With a career spanning over two decades, David H Hartke has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing unique solutions to address them. His work has been recognized globally for its impact and ingenuity.

Collaborations: Throughout his career, David H Hartke has collaborated with leading research institutions, universities, and innovative companies to bring his inventions to life. His ability to work across disciplines and industries has led to the development of groundbreaking technologies that have the potential to shape the future.

Conclusion: David H Hartke's passion for innovation and his relentless pursuit of excellence have solidified his position as a respected inventor in the technology sector. His dedication to creating solutions that have a positive impact on society sets him apart as a true pioneer in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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