Incep Technologies, Inc.

Other

Ncr Corporation

Molex Corporation

David H Hartke

Joseph Ted Dibene, Ii

Carl E Hoge

Edward J Derian

Joseph T DiBene

James M Broder

Jose B San Andres

James J Hjerpe Kaskade

James Hjerpe Kaskade

J Ted DiBene, Ii

Joseph S Riel

A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

System and method for processor power delivery and thermal management

A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management

Ultra-low impedance power interconnection system for electronic packages

The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.

Right-angle power interconnect electronic packaging assembly

A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board. A power signal from the power conditioning circuit is provided to the second circuit board at least in part by one of the first set of raised conductive contacts on the flexible circuit and the second set of raised conductive contacts on the second flexible circuit and a ground return is provided to the second circuit board by the other of the first set of raised conductive contacts on the first flexible circuit and the second set of raised conductive contacts on the second flexible circuit.

Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems

A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.

Separable power delivery connector

A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

Apparatus for delivering power to high performance electronic assemblies

Apparatus for providing power to a microprocessor with integrated thermal and EMI management

A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.

Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate

An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

Inter-circuit encapsulated packaging for power delivery

An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.

Inter-circuit encapsulated packaging

A Pulse Amplitude Modulation (PAM) generator that generates multilevel PAM signals at frequencies over 1 GHz is disclosed. The PAM generator uses Emitter Coupled Logic (ECL) technology that implements differential pair current switches such that the outputs are summed to produce precisely balanced PAM signals.

Growing community of inventors

Durango, CO, United States of America

David H Hartke