J Ted DiBene, Ii

Title: J Ted DiBene, II: Innovator in Electronic Packaging Assembly

Introduction

J Ted DiBene, II is a notable inventor based in Oceanside, California. He has made significant contributions to the field of electronic packaging, particularly with his innovative designs that enhance the efficiency and functionality of electronic devices. His work is characterized by a focus on practical solutions that address common challenges in electronic assembly.

Latest Patents

DiBene holds a patent for a Right-angle power interconnect electronic packaging assembly. This assembly features a mother board equipped with a processor carrier that has a processor attached. A heat sink is thermally coupled to the processor carrier and is strategically located on top of the carrier. Additionally, a voltage regulating module board is electrically coupled to the processor carrier and is designed to be positioned adjacent to the heat sink at a right angle to the mother board. This innovative design aims to optimize space and improve thermal management in electronic devices.

Career Highlights

J Ted DiBene, II is currently employed at Incep Technologies, Inc., where he continues to develop cutting-edge technologies in electronic packaging. His work at Incep Technologies has allowed him to collaborate with other talented professionals in the field, further enhancing his contributions to innovation.

Collaborations

One of his notable coworkers is David H. Hartke, with whom he has likely shared insights and expertise in their projects. Their collaboration exemplifies the importance of teamwork in driving technological advancements.

Conclusion

J Ted DiBene, II is a dedicated inventor whose work in electronic packaging assembly has the potential to influence the future of electronic device design. His innovative approach and commitment to excellence continue to make a significant impact in the industry.