Hubei Dinghui Microelectronics Materials Co., Ltd

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USPTO Granted Patents = 2

Forward Citations = 2

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6 inventors (with patents filed for the assignee):

Shunquan Zhu (1 out of 6 patents)

Yijie Luo (1 out of 1 patent)

Jiping Zhang (1 out of 1 patent)

4. Min Liu (1 out of 1 patent)

5. Liyuan Che (1 out of 2 patents)

6. Wentao Dan (1 out of 1 patent)

2 patents: Sort by Forward Citations

1. 11179822 - Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material (2021-11-23),

2. 10967481 - CMP layer based on porous cerium oxide and preparation method thereof (2021-04-06),

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USPTO Data Jan 1 1976 - Oct 20 2026

2 Patents

#44 in Hubei

#11,632 in China

Hubei, China

Hubei Dinghui Microelectronics Materials Co., Ltd

Forward Citations = 2

6 inventors:

Shunquan Zhu (1 out of 6 patents)

Yijie Luo (1 out of 1 patent)

Jiping Zhang (1 out of 1 patent)

4. Min Liu (1 out of 1 patent)

5. Liyuan Che (1 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hubei Dinghui Microelectronics Materials Co., Ltd. Retrieved from https://idiyas.com/company/hubei-dinghui-microelectronics-materials-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]