Wentao Dan

Title: The Innovative Contributions of Wentao Dan

Introduction

Wentao Dan is a notable inventor based in Sichuan, China. He has made significant contributions to the field of microelectronics materials, particularly in the development of chemical mechanical polishing (CMP) technologies. His work focuses on enhancing the efficiency and effectiveness of CMP pads used in semiconductor manufacturing.

Latest Patents

Wentao Dan holds a patent for a CMP layer based on porous cerium oxide and its preparation method. This invention relates to the technical field of CMP pad manufacture. The CMP layer is created by mixing and curing a polyurethane prepolymer, a crosslinking agent, and porous cerium oxide. The preparation involves several steps, including preheating the polyurethane prepolymer under vacuum, adding the porous cerium oxide filler, and thoroughly mixing to obtain a mixed prepolymer. The process continues with heat preservation, stirring, and circulation treatments, followed by the addition of the crosslinking agent and rapid mixing before injection into the mold. Finally, the mixture is cured and vulcanized to produce the polishing layer.

Career Highlights

Wentao Dan is currently employed at Hubei Dinghui Microelectronics Materials Co., Ltd. His role at the company allows him to apply his innovative ideas and technical expertise in the development of advanced materials for the semiconductor industry. His contributions have been instrumental in improving the performance of CMP pads, which are critical in the manufacturing of integrated circuits.

Conclusion

Wentao Dan's work exemplifies the spirit of innovation in the field of microelectronics. His patent on the CMP layer based on porous cerium oxide showcases his commitment to advancing technology in semiconductor manufacturing. Through his career, he continues to make impactful contributions that enhance the efficiency of manufacturing processes.