Forward Citations = 11

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7 inventors (with patents filed for the assignee):

Kai-Chiang Wu (3 out of 174 patents)

Shaw-Wei Chen (2 out of 2 patents)

Kai Wu (1 out of 4 patents)

4. Wan Hua Wu (1 out of 1 patent)

5. Virgil Liao (1 out of 1 patent)

6. Ben Weng (1 out of 1 patent)

7. Jai Yi Wang (1 out of 1 patent)

5 patents: Sort by Forward Citations

1. 7098524 - Electroplated wire layout for package sawing (2006-08-29),

2. 7095091 - Packaging stacked chips with finger structure (2006-08-22),

3. 7091590 - Multiple stacked-chip packaging structure (2006-08-15),

4. 6937477 - Structure of gold fingers (2005-08-30),

5. 6933592 - Substrate structure capable of reducing package singular stress (2005-08-23),

Company Overview

Global Advanced Packaging Technology H.k. Limited is a leading provider of innovative packaging solutions for various industries. With a focus on advanced technology and environmentally friendly practices, we strive to deliver high-quality packaging products to our customers worldwide. Our extensive range of packaging options includes sustainable materials, efficient designs, and customizable solutions to meet the unique needs of each client.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

5 Patents

#593 in Hong Kong

#5,271 in China

Hong Kong, China

Global Advanced Packaging Technology H.k. Limited

Forward Citations = 11

7 inventors:

Kai-Chiang Wu (3 out of 174 patents)

Shaw-Wei Chen (2 out of 2 patents)

Kai Wu (1 out of 4 patents)

4. Wan Hua Wu (1 out of 1 patent)

5. Virgil Liao (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Global Advanced Packaging Technology H.k. Limited. Retrieved from https://idiyas.com/company/global-advanced-packaging-technology-h-k

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]