Forward Citations = 10

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7 inventors (with patents filed for the assignee):

Kai-Chiang Wu (3 out of 169 patents)

Shaw-Wei Chen (2 out of 2 patents)

Kai Wu (1 out of 4 patents)

4. Wan Hua Wu (1 out of 1 patent)

5. Virgil Liao (1 out of 1 patent)

6. Ben Weng (1 out of 1 patent)

7. Jai Yi Wang (1 out of 1 patent)

5 patents: Sort by Forward Citations

1. 7098524 - Electroplated wire layout for package sawing (2006-08-29),

2. 7095091 - Packaging stacked chips with finger structure (2006-08-22),

3. 7091590 - Multiple stacked-chip packaging structure (2006-08-15),

4. 6937477 - Structure of gold fingers (2005-08-30),

5. 6933592 - Substrate structure capable of reducing package singular stress (2005-08-23),

Global Advanced Packaging Technology H.k. Limited is a leading provider of innovative packaging solutions for various industries. With a focus on advanced technology and environmentally friendly practices, we strive to deliver high-quality packaging products to our customers worldwide. Our extensive range of packaging options includes sustainable materials, efficient designs, and customizable solutions to meet the unique needs of each client.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 2 2025

5 Patents

#570 in Hong Kong

#4,536 in China

Hong Kong, China

Global Advanced Packaging Technology H.k. Limited