Ben Weng

Title: The Innovative Contributions of Ben Weng

Introduction

Ben Weng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of substrate technology, particularly in reducing package singular stress. His innovative approach has garnered attention in the industry, showcasing his expertise and dedication to advancing technology.

Latest Patents

Ben Weng holds a patent for a "Substrate structure capable of reducing package singular stress." This invention features a substrate with multiple units, each equipped with a molding gate at the corners. The design includes slots around the periphery of each unit, with connection portions strategically placed to minimize molding gate stress. This innovative structure not only reduces the risk of trace breakage but also prevents the peeling of molding compounds from the substrate.

Career Highlights

Ben Weng is currently employed at Global Advanced Packaging Technology H.K. Limited, where he continues to develop cutting-edge solutions in packaging technology. His work has been instrumental in enhancing the reliability and performance of substrate structures in various applications.

Collaborations

Throughout his career, Ben has collaborated with talented individuals such as Virgil Liao and Jai Yi Wang. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ben Weng's contributions to substrate technology exemplify the impact of innovative thinking in the field. His patent and ongoing work at Global Advanced Packaging Technology H.K. Limited highlight his commitment to advancing technology and improving product reliability.