Wan Hua Wu

Title: Innovations of Wan Hua Wu in Chip Packaging Technology.

Introduction

Wan Hua Wu is a notable inventor based in Taoyuan, Taiwan. She has made significant contributions to the field of chip packaging technology. Her innovative approach has led to the development of a unique multiple stacked-chip packaging structure.

Latest Patents

Wan Hua Wu holds a patent for a multiple stacked-chip packaging structure. This invention includes at least one lower layer chip located on a substrate, with a plurality of wires electrically connected to the bonding pads on the lower layer chip and to the substrate. Additionally, it features at least one carrier cap provided on the lower layer chip to create an accommodating space for the bonding pads and wires. An upper layer chip is also included, with wires connected to its bonding pads and the substrate. The invention is wrapped in a molding compound, ensuring that the layout patterns of bonding pads do not limit the design. This flexibility allows for chips to be placed on either layer according to requirements, facilitating the wire bonding process.

Career Highlights

Wan Hua Wu is currently employed at Global Advanced Packaging Technology H.K. Limited. Her work focuses on advancing packaging technologies that enhance the efficiency and effectiveness of chip designs.

Collaborations

Wan Hua Wu collaborates with her coworker, Kai Wu, who is also involved in innovative projects within the company.

Conclusion

Wan Hua Wu's contributions to chip packaging technology exemplify her innovative spirit and dedication to advancing the field. Her patent reflects a significant step forward in the design and functionality of stacked-chip structures.