Jai Yi Wang

Title: Innovations of Jai Yi Wang

Introduction

Jai Yi Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of substrate technology, particularly in reducing package singular stress. His innovative approach has led to the development of a unique substrate structure that addresses common issues in packaging.

Latest Patents

Wang holds a patent for a substrate structure capable of reducing package singular stress. This invention comprises a substrate with multiple substrate units, each featuring a molding gate at the corner. The design includes several slots around the periphery of each unit, with connection portions strategically placed to minimize molding gate stress. This innovative arrangement helps prevent trace breakage and peeling of the molding compound from the substrate.

Career Highlights

Jai Yi Wang is currently employed at Global Advanced Packaging Technology H.K. Limited, where he continues to advance his research and development efforts. His work has been instrumental in enhancing the reliability and performance of packaging solutions in the industry.

Collaborations

Wang collaborates with talented colleagues such as Virgil Liao and Ben Weng, contributing to a dynamic team focused on innovation and excellence in packaging technology.

Conclusion

Jai Yi Wang's contributions to substrate technology exemplify the impact of innovative thinking in solving complex engineering challenges. His patent reflects a commitment to improving product reliability and performance in the packaging industry.