Shaw-Wei Chen

Title: **Celebrating the Innovations of Shaw-Wei Chen**

Introduction

Shaw-Wei Chen is an accomplished inventor based in Hsinchu, Taiwan. With two patents to his name, he has made significant contributions to the field of advanced packaging technology. His work is pivotal for enhancing manufacturing processes and improving the reliability and cost-effectiveness of semiconductor packaging.

Latest Patents

Shaw-Wei Chen's latest inventions are particularly noteworthy. The first patent, titled "Electroplated Wire Layout for Package Sawing," introduces an innovative substrate configuration with multiple chip arrays. This design incorporates a kerf with scribe lines that enhance electric connections through strategically placed solder ball pads. The unique zigzag arrangement of the kerf electroplated wire facilitates an efficient cutting process, ultimately improving yield, reliability, and reducing costs.

The second patent, "Packaging Stacked Chips with Finger Structure," presents an improved finger structure for packaging stack configurations. This invention enhances chip layer connections by utilizing leading wires and finger sets with optimally designed finger units. The bending angle of these units is cleverly employed to strengthen the manufacturing process and reliability, while the use of an obverse bonding approach mitigates the downsides of reverse bonding strategies.

Career Highlights

Shaw-Wei Chen works at Global Advanced Packaging Technology H.K. Limited, where he applies his expertise in semiconductor packaging. His innovative contributions are integral to advancing technologies that improve efficiency and reliability in this competitive industry.

Collaborations

In his career, Shaw-Wei has worked alongside talented colleagues like Kai-Chiang Wu. Collaborations with such skilled professionals have fostered an environment conducive to innovation, enriching their company's technological advancements.

Conclusion

Shaw-Wei Chen is a remarkable inventor whose patents reflect his commitment to enhancing semiconductor packaging technologies. His contributions not only advance industry standards but also provide significant improvements in manufacturing processes. As the field continues to evolve, innovations like those conceived by Shaw-Wei will undoubtedly influence future advancements in technology.