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Kanagawa, Japan

Fab Solutions, Inc.

USPTO Granted Patents = 24

% Expired Patents = 70.8

Forward Citations = 287

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7 inventors (with patents filed for the assignee):

Keizo Yamada (24 out of 53 patents)

Takeo Ushiki (14 out of 17 patents)

Yousuke Itagaki (11 out of 14 patents)

4. Tohru Tsujide (10 out of 23 patents)

5. Yohsuke Itagaki (2 out of 4 patents)

6. Yosuke Itagaki (1 out of 1 patent)

7. Tohoru Tsujide (1 out of 1 patent)

24 patents: Sort by Forward Citations

1. 7321805 - Production managing system of semiconductor device (2008-01-22),

2. 7232994 - Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer (2007-06-19),

3. 7049834 - Semiconductor device test method and semiconductor device tester (2006-05-23),

4. 7002361 - Film thickness measuring apparatus and a method for measuring a thickness of a film (2006-02-21),

5. 6982418 - Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer (2006-01-03),

6. 6975125 - Semiconductor device tester (2005-12-13),

7. 6967327 - Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer (2005-11-22),

8. 6946857 - Semiconductor device tester (2005-09-20),

9. 6943043 - Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device (2005-09-13),

10. 6940296 - Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer (2005-09-06),

11. 6914444 - Semiconductor device test method and semiconductor device tester (2005-07-05),

12. 6900645 - Semiconductor device test method and semiconductor device tester (2005-05-31),

13. 6897440 - Contact hole standard test device (2005-05-24),

14. 6850079 - Film thickness measuring apparatus and a method for measuring a thickness of a film (2005-02-01),

15. 6842663 - Production managing system of semiconductor device (2005-01-11),

Company Overview

Fab Solutions, Inc. is a technology-driven company based in Kanagawa, Japan, specializing in advanced manufacturing solutions and semiconductor fabrication technologies. The organization focuses on developing innovative processes and equipment that enhance production efficiency and product quality in the semiconductor industry. With a commitment to research and development, Fab Solutions aims to address the evolving needs of the electronics market, providing cutting-edge solutions that support the growth of various technology sectors.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

24 Patents

#90 in Kanagawa

#2,632 in Japan

#26,628 in the World

Kanagawa, Japan

Fab Solutions, Inc.

Forward Citations = 287

7 inventors:

Keizo Yamada (24 out of 53 patents)

Takeo Ushiki (14 out of 17 patents)

Yousuke Itagaki (11 out of 14 patents)

4. Tohru Tsujide (10 out of 23 patents)

5. Yohsuke Itagaki (2 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Fab Solutions, Inc.. Retrieved from https://idiyas.com/company/fab-solutions

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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