For the Inventor, By the Inventor

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Palo Alto, CA, United States of America

Express Packaging Systems, Inc.

USPTO Granted Patents = 3

Forward Citations = 322

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8 inventors (with patents filed for the assignee):

John H Lau (3 out of 4 patents)

Tzyy Jang Tseng (1 out of 3 patents)

Wei H Koh (1 out of 30 patents)

4. Chen-Hua Cheng (1 out of 1 patent)

5. Kuan Luen Chen (1 out of 2 patents)

6. Frank H Wu (1 out of 1 patent)

7. Tai-Yu Chou (1 out of 1 patent)

8. Yung Shih Chen (1 out of 1 patent)

3 patents: Sort by Forward Citations

1. 6075710 - Low-cost surface-mount compatible land-grid array (LGA) chip scale (2000-06-13),

2. 6057601 - Heat spreader with a placement recess and bottom saw-teeth for (2000-05-02),

3. 5825084 - Single-core two-side substrate with u-strip and co-planar signal traces, (1998-10-20),

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USPTO Data Jan 1 1976 - Sep 15 2026

3 Patents

#430 in Palo Alto, CA

#16,817 in California

#73,706 in US

Palo Alto, CA, United States of America

Express Packaging Systems, Inc.

Forward Citations = 322

8 inventors:

John H Lau (3 out of 4 patents)

Tzyy Jang Tseng (1 out of 3 patents)

Wei H Koh (1 out of 30 patents)

4. Chen-Hua Cheng (1 out of 1 patent)

5. Kuan Luen Chen (1 out of 2 patents)

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