This inventor holds 1 USPTO granted patent. Top assignee: Express Packaging Systems, Inc.. Active years: 1998.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1998
Title: Frank H Wu: Innovator in Semiconductor Packaging
Introduction
Frank H Wu is a notable inventor based in Sunnyvale, CA. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and solutions. His work focuses on optimizing the performance and cost-effectiveness of semiconductor devices.
Latest Patents
Frank H Wu holds a patent for a "Single-core two-side substrate with u-strip and co-planar signal traces." This invention introduces a new substrate with a two metal layer circuit structure and layout for semiconductor packaging. The design simplifies the packaging structure by utilizing only one dielectric layer and a conventional printed circuit board fabrication process. This innovation addresses the complexities and higher production costs associated with multiple layer and high-density configurations. The improved circuit structure is achieved by implementing a segmented ring on one side of the substrate and a split plane on the other side, forming a single layer substrate structure. The edges of the substrate are coated with a metal layer to provide inter-layer connections. This design not only enhances performance and reduces costs but also offers flexibility in selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.
Career Highlights
Frank H Wu is currently associated with Express Packaging Systems, Inc., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor devices.
Collaborations
Frank has collaborated with notable colleagues such as John H Lau and Yung Shih Chen, contributing to various projects and innovations in the field.
Conclusion
Frank H Wu's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to enhancing technology in this critical area. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile