Sunnyvale, CA, United States of America

Frank H Wu

This inventor holds 1 USPTO granted patent. Top assignee: Express Packaging Systems, Inc.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Frank H Wu. Retrieved from https://idiyas.com/inventor/frank-h-wu-gf6gbg2w

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 65(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Frank H Wu: Innovator in Semiconductor Packaging

Introduction

Frank H Wu is a notable inventor based in Sunnyvale, CA. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and solutions. His work focuses on optimizing the performance and cost-effectiveness of semiconductor devices.

Latest Patents

Frank H Wu holds a patent for a "Single-core two-side substrate with u-strip and co-planar signal traces." This invention introduces a new substrate with a two metal layer circuit structure and layout for semiconductor packaging. The design simplifies the packaging structure by utilizing only one dielectric layer and a conventional printed circuit board fabrication process. This innovation addresses the complexities and higher production costs associated with multiple layer and high-density configurations. The improved circuit structure is achieved by implementing a segmented ring on one side of the substrate and a split plane on the other side, forming a single layer substrate structure. The edges of the substrate are coated with a metal layer to provide inter-layer connections. This design not only enhances performance and reduces costs but also offers flexibility in selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.

Career Highlights

Frank H Wu is currently associated with Express Packaging Systems, Inc., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor devices.

Collaborations

Frank has collaborated with notable colleagues such as John H Lau and Yung Shih Chen, contributing to various projects and innovations in the field.

Conclusion

Frank H Wu's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to enhancing technology in this critical area. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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