John H Lau

Title: Innovations by John H Lau

Introduction

John H Lau is a notable inventor based in Palo Alto, CA, with a focus on advancements in electronic packaging and soldering techniques. He holds a total of 4 patents, showcasing his contributions to the field of electrical connectors and semiconductor packaging.

Latest Patents

One of his latest patents is a positioning method for attaching a solder ball to an electrical connector. This method involves several steps, including arranging the contact tail into a center region and a peripheral region, applying solder paste, and positioning a solder ball for reflow soldering. Another significant patent is for a low-cost surface-mount compatible land-grid array (LGA) chip scale. This invention details a semiconductor packaging assembly that supports an integrated circuit (IC) chip on a double-layer substrate, utilizing low melting point solder for secure attachment to printed circuit boards.

Career Highlights

Throughout his career, John H Lau has worked with various companies, including Express Packaging Systems, Inc. and Hon Hai Precision Industry Co., Ltd. His work has significantly impacted the efficiency and reliability of electronic packaging processes.

Collaborations

John has collaborated with notable professionals in the field, including Tzyy Jang Tseng and Chen-Hua Cheng. Their combined expertise has contributed to the development of innovative solutions in electronic packaging.

Conclusion

John H Lau's contributions to the field of electronics through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in electronic packaging and soldering techniques.