The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2001

Filed:

Apr. 30, 1999
Applicant:
Inventors:

John H. Lau, Palo Alto, CA (US);

Scott Lin, Fremont, CA (US);

Ming-Lun Szu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/102 ;
Abstract

A method for positioning a solder ball onto a contact tail of an electrical connector comprises several steps. Firstly, arrange the contact tail into a center region and a peripheral region surrounding the center region. Secondly, attach solder paste onto the center region of the contact tail via a first mesh painting procedure. Thirdly, attach solder resist onto the peripheral region of the contact tail via a second mesh painting procedure. Fourthly, position a solder ball on the center region of the contact tail via a screen board. Fifthly, apply a reflow soldering procedure on the solder ball so that the solder ball can be soldered on the solder paste attached to the center region of the contact tail.


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Lau, John. (2001). Positioning method for attaching a solder ball to an electrical connector and the connector using the same (U.S. Patent No. 6299058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6299058

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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