Yung Shih Chen

Title: Innovations by Yung Shih Chen

Introduction

Yung Shih Chen is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor packaging through his innovative designs and patents. His work focuses on optimizing the performance and cost-effectiveness of semiconductor devices.

Latest Patents

Yung Shih Chen holds a patent for a "Single-core two-side substrate with u-strip and co-planar signal traces." This invention discloses a new substrate with a two metal layer circuit structure and layout for semiconductor packaging. The design optimizes the speed and performance characteristics of semiconductor devices while simplifying the packaging structure. By utilizing only one dielectric layer and a conventional printed circuit board fabrication process, the complexities and higher production costs associated with multiple layers and high-density configurations are avoided. The improved circuit structure is achieved by implementing a segmented ring on one side of the substrate and a split plane on the other side, forming a single-layer substrate structure. The edges of the substrate are coated with a metal layer to provide inter-layer connections. This innovation not only enhances performance and reduces costs but also offers flexibility in selecting the location and number of input and output signal lines and connections to ground and power planes from the semiconductor device.

Career Highlights

Yung Shih Chen is currently employed at Express Packaging Systems, Inc., where he continues to develop innovative solutions in semiconductor packaging. His work has garnered attention for its practical applications and contributions to the industry.

Collaborations

Yung Shih Chen has collaborated with notable colleagues, including John H Lau and Tai-Yu Chou. These partnerships have further enriched his work and expanded the impact of his inventions.

Conclusion

Yung Shih Chen's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology in this field. His work not only addresses current challenges but also paves the way for future developments in semiconductor design and manufacturing.