Company Filing History:
Years Active: 2000
Title: Innovations by Chen-Hua Cheng in Semiconductor Packaging
Introduction
Chen-Hua Cheng is a notable inventor based in Taoyuan Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in optimizing the performance and cost-effectiveness of integrated circuits.
Latest Patents
Chen-Hua Cheng holds a patent for a heat spreader with a placement recess and bottom saw-teeth. This invention discloses a new semiconductor ball grid array package for integrated circuits that have input and output counts higher than 250. The design optimizes the speed and performance characteristics of the semiconductor device while simplifying the packaging structure. By utilizing only one dielectric layer and a regular printed circuit board fabrication process, the complexities and higher costs associated with multiple layer substrates for high-density interconnection configurations are resolved. The improved package assembly features a segmented ring on one side of the substrate and a split plane on the other side, forming a single layer substrate structure. The edges of the substrate are coated with a metal layer to provide interlayer connections. This package assembly applies a cavity down configuration with an integrated heat spreader attached, ensuring that the IC wire bonds within the cavity are sealed with an organic encapsulant. The design offers high performance at a low cost, while also providing flexibility in selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.
Career Highlights
Chen-Hua Cheng is currently employed at Express Packaging Systems, Inc., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the efficiency and effectiveness of integrated circuit designs.
Collaborations
Chen-Hua Cheng has collaborated with notable colleagues, including John H Lau and Tzyy Jang Tseng, contributing to various projects and innovations in the field.
Conclusion
Chen-Hua Cheng's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patent reflects a significant advancement in the design and functionality of integrated circuits, showcasing his expertise and dedication to improving technology.
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