Enter assignee name

% Expired Patents = 45.0

Forward Citations = 2,061

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6 inventors (with patents filed for the assignee):

Charles W Eichelberger (18 out of 131 patents)

James E Kohl (15 out of 15 patents)

Donald V Nowicki (2 out of 3 patents)

4. Christopher A Munroe (2 out of 3 patents)

5. Paul V Starenas (1 out of 6 patents)

6. Michael E Rickley (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 8590145 - Method of fabricating a circuit structure (2013-11-26),

2. 8564119 - Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2013-10-22),

3. 8533941 - Method of bonding two structures together with an adhesive line of controlled thickness (2013-09-17),

4. 8474133 - Method of fabricating a base layer circuit structure (2013-07-02),

5. 8384199 - Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2013-02-26),

6. 8324020 - Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2012-12-04),

7. 8169065 - Stackable circuit structures and methods of fabrication thereof (2012-05-01),

8. 7868445 - Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer (2011-01-11),

9. 7863090 - Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system (2011-01-04),

10. 7830000 - Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2010-11-09),

11. 7619901 - Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system (2009-11-17),

12. 7112467 - Structure and method for temporarily holding integrated circuit chips in accurate alignment (2006-09-26),

13. 6818544 - Compliant, solderable input/output bump structures (2004-11-16),

14. 6555908 - Compliant, solderable input/output bump structures (2003-04-29),

15. 6426545 - Integrated circuit structures and methods employing a low modulus high elongation photodielectric (2002-07-30),

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