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% Expired Patents = 45.0

Forward Citations = 2,061

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6 inventors (with patents filed for the assignee):

Charles W Eichelberger (18 out of 131 patents)

James E Kohl (15 out of 15 patents)

Donald V Nowicki (2 out of 3 patents)

4. Christopher A Munroe (2 out of 3 patents)

5. Paul V Starenas (1 out of 6 patents)

6. Michael E Rickley (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 8590145 - Method of fabricating a circuit structure (2013-11-26),

2. 8564119 - Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2013-10-22),

3. 8533941 - Method of bonding two structures together with an adhesive line of controlled thickness (2013-09-17),

4. 8474133 - Method of fabricating a base layer circuit structure (2013-07-02),

5. 8384199 - Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2013-02-26),

6. 8324020 - Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2012-12-04),

7. 8169065 - Stackable circuit structures and methods of fabrication thereof (2012-05-01),

8. 7868445 - Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer (2011-01-11),

9. 7863090 - Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system (2011-01-04),

10. 7830000 - Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2010-11-09),

11. 7619901 - Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system (2009-11-17),

12. 7112467 - Structure and method for temporarily holding integrated circuit chips in accurate alignment (2006-09-26),

13. 6818544 - Compliant, solderable input/output bump structures (2004-11-16),

14. 6555908 - Compliant, solderable input/output bump structures (2003-04-29),

15. 6426545 - Integrated circuit structures and methods employing a low modulus high elongation photodielectric (2002-07-30),

Epic Technologies, Inc. is a prominent player in the field of advanced technology solutions, specializing in the development and manufacturing of innovative electronic systems and components. Based in Woburn, MA, the company focuses on delivering high-performance products that cater to various industries, including telecommunications, aerospace, and defense. With a commitment to research and development, Epic Technologies aims to push the boundaries of technology, providing cutting-edge solutions that meet the evolving needs of its clients.

Profile summary based on public USPTO records.