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For the Inventor, By the Inventor

Reading, MA, United States of America

James E Kohl

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.0

ph-index = 13

Forward Citations = 1,124(Granted Patents)


Company Filing History:

goldMedal15 out of 20 
 
Epic Technologies, Inc.
 patents

Years Active: 2002-2013

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15 patents (USPTO):Explore Patents
1. 8590145 - Method of fabricating a circuit structure (2013-11-26),
2. 8564119 - Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2013-10-22),
3. 8533941 - Method of bonding two structures together with an adhesive line of controlled thickness (2013-09-17),
4. 8474133 - Method of fabricating a base layer circuit structure (2013-07-02),
5. 8384199 - Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2013-02-26),
6. 8324020 - Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2012-12-04),
7. 8169065 - Stackable circuit structures and methods of fabrication thereof (2012-05-01),
8. 7868445 - Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer (2011-01-11),
9. 7863090 - Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system (2011-01-04),
10. 7830000 - Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system (2010-11-09),
11. 7619901 - Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system (2009-11-17),
12. 6818544 - Compliant, solderable input/output bump structures (2004-11-16),
13. 6555908 - Compliant, solderable input/output bump structures (2003-04-29),
14. 6426545 - Integrated circuit structures and methods employing a low modulus high elongation photodielectric (2002-07-30),
15. 6396148 - Electroless metal connection structures and methods (2002-05-28),

Title: Innovator Overview: James E. Kohl

Introduction: James E. Kohl, an esteemed inventor based in Reading, MA, holds an impressive portfolio of 15 patents, showcasing his expertise in the field of electronic circuit fabrication. His contributions to technology have significantly advanced methods used in the development of compact electronic systems.

Latest Patents: Some of his latest patents include a groundbreaking method of fabricating a circuit structure. This innovative approach involves forming a chip layer that integrates a structural material around and in contact with the surface of each chip, ensuring a streamlined design. The fabrication method aims to enhance the durability of the chip layer by including a strengthening structure over its back surface, thereby fortifying the interface between the chips and the surrounding material.

Additionally, Kohl's work in integrated thermal structures introduces methods for effectively implementing an entire electronic system within a compact package. This includes a chips-first multichip base layer featuring conductive structures that extend throughout. The innovative interconnect layer and redistribution layer improve connectivity and efficiency, providing a robust foundation for modern electronic devices such as cell phones.

Career Highlights: James E. Kohl has made significant strides in the engineering field as a key inventor at Epic Technologies, Inc. His technical accomplishments and patent filings have not only shaped his career but have also paved the way for advancements in electronic manufacturing and design.

Collaborations: Throughout his career, Kohl has collaborated with notable peers, including Charles W. Eichelberger and Michael E. Rickley. These partnerships have further enriched his innovative endeavors and contributed to the success of various projects within the company.

Conclusion: With 15 patents to his name, James E. Kohl stands out as a prominent figure in the realm of electronic innovation. His work in circuit fabrication and integrated thermal structures continues to influence the technology landscape, demonstrating the vital role that skilled inventors play in shaping the future of electronics.

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