The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2013

Filed:

Oct. 16, 2009
Applicants:

Charles W. Eichelberger, Wakefield, MA (US);

James E. Kohl, Reading, MA (US);

Inventors:

Charles W. Eichelberger, Wakefield, MA (US);

James E. Kohl, Reading, MA (US);

Assignee:

Epic Technologies, Inc., Woburn, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of bonding two structures together with an adhesive line of controlled thickness is provided. The method includes: applying an adhesive of controlled thickness to a first surface of a first structure; at least partially curing the adhesive; applying additional adhesive to the partially cured adhesive applied to the first surface or to a second surface of a second structure; holding the first structure and the second structure in alignment with the first surface and the second surface disposed in spaced, opposing relation; applying a force to the first structure and/or the second structure to squeeze the additional adhesive between the second surface and the partially cured adhesive applied to the first surface to reduce a thickness of the additional adhesive; and at least partially curing the additional adhesive to bond the first and second structures together.


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