Michael E Rickley

Title: **Innovative Contributions of Michael E. Rickley in Electroless Metal Connection Structures**

Introduction

Michael E. Rickley, an inventor based in Reading, Massachusetts, has made significant strides in the field of electronic packaging. With one patent to his name, he has developed innovative methods that enhance the performance and reliability of integrated circuits. His work represents a crucial advancement in the technology of chip packaging.

Latest Patents

Rickley's notable patent is focused on "Electroless Metal Connection Structures and Methods." This patent details a novel approach for fabricating chips that utilize electroless metallizations. The innovative method involves the application of an electroless barrier metal that is placed over and in electrical contact with at least one aluminum contact pad of a chip's integrated circuit. The electroless barrier metal serves as a differentiating layer, being a first electroless metal that is distinct from the aluminum contact pad. Additionally, an electroless interconnect metal is applied above the barrier, which comprises a second electroless metal that contrasts with the first. For instance, the barrier can consist of electroless nickel while the interconnect can be electroless copper. This unique configuration optimizes the electrical connections within microelectronics.

Career Highlights

Rickley currently works at Epic Technologies, Inc., where he focuses on advancing electronic packaging techniques. His expertise in electroless processes enables the creation of robust and efficient connection structures that meet the increasingly demanding standards of modern electronic applications.

Collaborations

Throughout his career, Rickley has had the opportunity to collaborate with skilled professionals in the field, including coworkers Charles W. Eichelberger and James E. Kohl. These collaborations have allowed for the exchange of ideas and technical know-how, further enhancing the development of innovative solutions in electronic packaging.

Conclusion

Michael E. Rickley's contributions to the field of electronic packaging and his patented methods for electroless metal connection structures highlight the importance of innovation in technology. His work not only advances the capabilities of integrated circuits but also demonstrates the continued need for inventive solutions in the ever-evolving landscape of electronics.