Enter assignee name

% Expired Patents = 60.0

Forward Citations = 11

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10 inventors (with patents filed for the assignee):

Kang-Hyun Lee (1 out of 9 patents)

Keun Hyuk Lim (1 out of 17 patents)

Heung Jin Kim (1 out of 6 patents)

4. Woong Je Sung (1 out of 10 patents)

5. Chee Hong Choi (1 out of 14 patents)

6. Bum Sik Kim (1 out of 4 patents)

7. Hyuk Woo (1 out of 2 patents)

8. Shang Won Kim (1 out of 4 patents)

9. Sang Hun Oh (1 out of 5 patents)

10. Cheolsoo Park (1 out of 11 patents)

10 patents: Sort by Forward Citations

1. 7727851 - Method of measuring shifted epitaxy layer by buried layer (2010-06-01),

2. 7646048 - CMOS image sensor (2010-01-12),

3. 7645672 - Mask ROM, method for fabricating the same, and method for coding the same (2010-01-12),

4. 7642613 - CMOS image sensor and method for fabricating the same (2010-01-05),

5. 7491993 - CMOS image sensor and method for manufacturing the same (2009-02-17),

6. 7176101 - Method of forming isolation oxide layer in semiconductor integrated circuit device (2007-02-13),

7. 7172959 - Method for forming dual damascene interconnection in semiconductor device (2007-02-06),

8. 7166511 - Method for fabricating split gate flash memory device (2007-01-23),

9. 7067921 - Method for fabricating a metal-insulator-metal capacitor in a semiconductor device (2006-06-27),

10. 6790754 - Methods for manufacturing a semiconductor device (2004-09-14),

Dongbu Electronics is a leading provider of semiconductor packaging and testing services. With innovative technologies and a commitment to quality, Dongbu serves a diverse range of industries including telecommunications, automotive, and consumer electronics. Their state-of-the-art facilities and experienced team ensure that customers receive reliable and efficient solutions for their semiconductor needs.

Profile summary based on public USPTO records.