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Disco Abrasive Systems, Ltd.

USPTO Granted Patents = 20

Trademarks = 1

Forward Citations = 371

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13 inventors (with patents filed for the assignee):

Masanori Uga (3 out of 8 patents)

Takatoshi Ono (3 out of 8 patents)

Shinji Sekiya (3 out of 10 patents)

4. Yoshio Umeda (2 out of 3 patents)

5. Toshiyuki Mori (2 out of 4 patents)

6. Shuji Tabuchi (2 out of 4 patents)

7. Mitsuo Sekiya (1 out of 1 patent)

8. Keiichi Kajiyama (1 out of 1 patent)

9. Ono Takatoshi (1 out of 1 patent)

10. Yuzo Nonaka (1 out of 1 patent)

11. Shinichi Tamura (1 out of 1 patent)

12. Yasuji Tada (1 out of 1 patent)

13. Isao Yukawa (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 4947598 - Method for grinding the surface of a semiconductor wafer (1990-08-14),

2. 4872289 - Cutter (1989-10-10),

3. 4843766 - Cutting tool having concentrically arranged outside and inside abrasive (1989-07-04),

4. 4839996 - Method and apparatus for machining hard, brittle and (1989-06-20),

5. 4817341 - Cutting tool having concentrically arranged outside and inside abrasive (1989-04-04),

6. 4757550 - Automatic accurate alignment system (1988-07-12),

7. 4753049 - Method and apparatus for grinding the surface of a semiconductor (1988-06-28),

8. 4720635 - Automatic accurate alignment system (1988-01-19),

9. 4705016 - Precision device for reducing errors attributed to temperature change (1987-11-10),

10. 4696712 - Semiconductor wafer mounting and cutting system (1987-09-29),

11. 4693036 - Semiconductor wafer surface grinding apparatus (1987-09-15),

12. 4688540 - Semiconductor wafer dicing machine (1987-08-25),

13. 4672557 - Automatic accurate alignment system (1987-06-09),

14. 4652135 - Article holding apparatus and its use (1987-03-24),

15. 4603609 - Apparatus for cutting a sheet-like member applied to a surface of a (1986-08-05),

Disco Abrasive Systems, Ltd. is a leading manufacturer of high-quality abrasive products. With over 50 years of experience in the industry, we offer a wide range of cutting-edge solutions for precision cutting, grinding, and polishing applications. Our cutting-edge technology and commitment to quality make us a trusted partner for customers in various industries worldwide.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Sep 22 2026

20 Patents

#1,342 in Tokyo

#2,941 in Japan

#31,196 in the World

Disco Abrasive Systems, Ltd.

Forward Citations = 371

13 inventors:

Masanori Uga (3 out of 8 patents)

Takatoshi Ono (3 out of 8 patents)

Shinji Sekiya (3 out of 10 patents)

4. Yoshio Umeda (2 out of 3 patents)

5. Toshiyuki Mori (2 out of 4 patents)

Please report any incorrect information to [email protected]

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