For the Inventor, By the Inventor

Enter assignee name

Disco Abrasive Systems, Ltd.

USPTO Granted Patents = 20

Trademarks = 1

Forward Citations = 371

Loading Chart...

Loading Chart...

13 inventors (with patents filed for the assignee):

Masanori Uga (3 out of 8 patents)

Takatoshi Ono (3 out of 8 patents)

Shinji Sekiya (3 out of 10 patents)

4. Yoshio Umeda (2 out of 3 patents)

5. Toshiyuki Mori (2 out of 4 patents)

6. Shuji Tabuchi (2 out of 4 patents)

7. Mitsuo Sekiya (1 out of 1 patent)

8. Keiichi Kajiyama (1 out of 1 patent)

9. Ono Takatoshi (1 out of 1 patent)

10. Yuzo Nonaka (1 out of 1 patent)

11. Shinichi Tamura (1 out of 1 patent)

12. Yasuji Tada (1 out of 1 patent)

13. Isao Yukawa (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 4947598 - Method for grinding the surface of a semiconductor wafer (1990-08-14),

2. 4872289 - Cutter (1989-10-10),

3. 4843766 - Cutting tool having concentrically arranged outside and inside abrasive (1989-07-04),

4. 4839996 - Method and apparatus for machining hard, brittle and (1989-06-20),

5. 4817341 - Cutting tool having concentrically arranged outside and inside abrasive (1989-04-04),

6. 4757550 - Automatic accurate alignment system (1988-07-12),

7. 4753049 - Method and apparatus for grinding the surface of a semiconductor (1988-06-28),

8. 4720635 - Automatic accurate alignment system (1988-01-19),

9. 4705016 - Precision device for reducing errors attributed to temperature change (1987-11-10),

10. 4696712 - Semiconductor wafer mounting and cutting system (1987-09-29),

11. 4693036 - Semiconductor wafer surface grinding apparatus (1987-09-15),

12. 4688540 - Semiconductor wafer dicing machine (1987-08-25),

13. 4672557 - Automatic accurate alignment system (1987-06-09),

14. 4652135 - Article holding apparatus and its use (1987-03-24),

15. 4603609 - Apparatus for cutting a sheet-like member applied to a surface of a (1986-08-05),

Company Overview

Disco Abrasive Systems, Ltd. is a leading manufacturer specializing in precision cutting, grinding, and polishing equipment for the semiconductor and electronics industries. The company focuses on developing advanced abrasive technologies that enhance the efficiency and quality of material processing. With a strong presence in Tokyo, Japan, Disco is committed to innovation and excellence, providing solutions that meet the evolving needs of its global clientele in high-tech manufacturing sectors.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

20 Patents

#1,343 in Tokyo

#2,945 in Japan

#31,295 in the World

Disco Abrasive Systems, Ltd.

Forward Citations = 371

13 inventors:

Masanori Uga (3 out of 8 patents)

Takatoshi Ono (3 out of 8 patents)

Shinji Sekiya (3 out of 10 patents)

4. Yoshio Umeda (2 out of 3 patents)

5. Toshiyuki Mori (2 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Disco Abrasive Systems, Ltd.. Retrieved from https://idiyas.com/company/disco-abrasive-systems

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…