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For the Inventor, By the Inventor

Tokyo, Japan

Shinji Sekiya

This inventor holds 10 USPTO granted patents. Top assignees: Disco Co., Ltd., Disco Abrasive Systems, Ltd.. Active years: 1983-1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinji Sekiya. Retrieved from https://idiyas.com/inventor/shinji-sekiya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 7

Forward Citations = 153(Granted Patents)


Company Filing History:

goldMedal7 out of 7 
 
Disco Co., Ltd.
 patents
silverMedal3 out of 20 
 
Disco Abrasive Systems, Ltd.
 patents

Years Active: 1983-1989

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10 patents (USPTO):Explore Patents
1. 4839996 - Method and apparatus for machining hard, brittle and (1989-06-20),
2. 4705016 - Precision device for reducing errors attributed to temperature change (1987-11-10),
3. 4625463 - Wafer attracting and fixing device (1986-12-02),
4. 4617766 - Grinding wheel for flat plates (1986-10-21),
5. 4567694 - Grinding wheel for grinding the flat surface of a hard and brittle (1986-02-04),
6. 4565034 - Grinding and/or cutting endless belt (1986-01-21),
7. 4545154 - Grinding wheel for flat plates (1985-10-08),
8. 4521995 - Wafer attracting and fixing device (1985-06-11),
9. 4445300 - Method for grinding flat plates (1984-05-01),
10. 4411107 - Grinding wheel for flat plates (1983-10-25),

Title: The Innovative Contributions of Shinji Sekiya

Introduction

Shinji Sekiya is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of machining and precision devices, holding a total of 10 patents. His work focuses on enhancing the efficiency and accuracy of machining processes, particularly for hard and brittle materials.

Latest Patents

Among his latest patents, Sekiya has developed a method and apparatus for machining hard, brittle, and difficultly machinable workpieces using a grinding wheel made of superabrasive grains. This innovative grinding wheel operates at a peripheral speed ranging from 1000 to 5500 m/min, with a relative movement between the grinding wheel and the workpiece at a feed speed of at least 30 mm/sec. Another notable patent is a precision device designed to reduce errors attributed to temperature changes. This device features a holding mechanism for an object and a supporting mechanism for an operating element, with one component being movable in a predetermined direction. It includes a detecting device that measures the movement of the mechanisms and accounts for thermal expansion, ensuring high precision in various temperature ranges.

Career Highlights

Shinji Sekiya has worked with notable companies such as Disco Co., Ltd. and Disco Abrasive Systems, Ltd. His experience in these organizations has allowed him to apply his innovative ideas and contribute to advancements in machining technology.

Collaborations

One of his notable collaborators is Takatoshi Ono, with whom he has worked on various projects to enhance machining processes and precision devices.

Conclusion

Shinji Sekiya's contributions to the field of machining and precision devices are noteworthy. His innovative patents and career achievements reflect his dedication to advancing technology in this area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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