The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1987
Filed:
Oct. 25, 1985
Yuzo Nonaka, Chiba, JP;
Disco Abrasive Systems, Ltd., Tokyo, JP;
Abstract
A semiconductor wafer mounting and cutting system including a wafer mounting machine for mounting a semiconductor wafer to a frame and a wafer cutting machine for receiving the frame and the wafer mounted thereto fed from the wafer mounting machine and cutting the wafer as required. The system further includes a controlling device for forming a relative relation signal showing a relative relation between a first indication which has been or is applied to the frame and a second indication of the wafer, which wafer has been or is mounted to the frame, and memory means for memorizing the relative relation signal formed by the controlling device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile