Nagareyama, Japan

Ono Takatoshi


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 1986

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1 patent (USPTO):Explore Patents

Title: Inventor Ono Takatoshi: Innovating Semiconductor Processing

Introduction: Ono Takatoshi, an accomplished inventor based in Nagareyama, Japan, has made a significant contribution to the field of semiconductor technology. His innovative approach has led to the development of a unique apparatus designed for cutting sheet-like members, specifically adhesive tape, applied to semiconductor wafers. With a patent to his name, Takatoshi stands out as a figure of ingenuity in the realm of precise semiconductor manufacturing.

Latest Patents: Ono Takatoshi holds a noteworthy patent for an "Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer." This invention addresses the challenges of cutting adhesive tape at the periphery of semiconductor wafers, enhancing the manufacturing process. The apparatus incorporates a heating rod that makes contact with the wafer's periphery, along with heating means, urging mechanisms, and a moving mechanism for precision cutting. This clever design ensures that the adhesive tape is melted and cut effectively, thus maintaining the integrity of the semiconductor wafer.

Career Highlights: Takatoshi's career is marked by his dedicated work at Disco Abrasive Systems, Ltd., a company known for its commitment to innovation in semiconductor processing technologies. His focus on refining fabrication techniques demonstrates his expertise and dedication to advancing the semiconductor industry.

Collaborations: Throughout his professional journey, Ono Takatoshi has likely engaged in collaborations with other innovators, researchers, and engineers within the semiconductor field. These partnerships foster a spirit of innovation and drive advancements in technology, although specific collaborative efforts are not publicly documented.

Conclusion: Ono Takatoshi is a testament to the power of innovation in technology, especially within the semiconductor sector. His patent for an apparatus designed to cut adhesive tape on wafers not only showcases his inventive prowess but also contributes to the efficiency and precision of semiconductor manufacturing processes. As technology continues to evolve, inventors like Takatoshi play a crucial role in shaping the future of industrial applications.

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