For the Inventor, By the Inventor

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Milpitas, CA, United States of America

Avantek, Inc.

USPTO Granted Patents = 32

Forward Citations = 771

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30 inventors (with patents filed for the assignee):

Amarpal S Khanna (5 out of 8 patents)

Chang-Hwang Hua (5 out of 5 patents)

Simon S Chan (4 out of 62 patents)

4. Ding-Yuan S Day (4 out of 4 patents)

5. Issy Kipnis (2 out of 15 patents)

6. Michael Louis Frank (2 out of 46 patents)

7. Marshall Maple (2 out of 3 patents)

8. Francois Hebert (1 out of 104 patents)

9. Forrest F Fulton (1 out of 16 patents)

10. Wayne Kennan (1 out of 17 patents)

11. Adrian C Lee (1 out of 1 patent)

12. John C Rosenberg (1 out of 1 patent)

13. James P Slupe (1 out of 1 patent)

14. Masahiro Omori (1 out of 5 patents)

15. Richard G Barber (1 out of 1 patent)

Core Competencies:

Bipolar Emitter-Base Structure

Self-Aligned Transistor Electrode

Broadband Printed Spiral

Wafer Thinning Process

Microwave Circuit Module

Phase-Compensated Frequency

High Isolation Amplifier

Thin-Film Microwave Filter

Dielectric Resonator Oscillator

Distributed Amplifier

Switchable Microwave Oscillator

Transmission Characteristics Measurement

32 patents: Sort by Forward Citations

1. 5306649 - Method for producing a fully walled emitter-base structure in a bipolar (1994-04-26),

2. 5288660 - Method for forming self-aligned t-shaped transistor electrode (1994-02-22),

3. 5215866 - Broadband printed spiral (1993-06-01),

4. 5127984 - Rapid wafer thinning process (1992-07-07),

5. 5126827 - Semiconductor chip header having particular surface metallization (1992-06-30),

6. 5111455 - Interleaved time-division multiplexor with phase-compensated frequency (1992-05-05),

7. 5045731 - Ultraminiature 180 degree phase shifter (1991-09-03),

8. 4988959 - YIG tuned oscillator using composite feedback (1991-01-29),

9. 4978639 - Method for the simultaneous formation of via-holes and wraparound (1990-12-18),

10. 4975065 - Microwave circuit module connector (1990-12-04),

11. 4954790 - Enhanced coupled, even mode terminated baluns, and mixers and modulators (1990-09-04),

12. 4940949 - High efficiency high isolation amplifier (1990-07-10),

13. 4928078 - Branch line coupler (1990-05-22),

14. 4926292 - Broadband printed spiral (1990-05-15),

15. 4912430 - Current source as a microwave biasing element (1990-03-27),

Company Overview

Avantek, Inc. is a technology company based in Milpitas, California, specializing in the development and manufacturing of advanced electronic components and systems. The company focuses on high-performance solutions for various applications, including telecommunications, aerospace, and industrial automation. With a commitment to innovation, Avantek leverages cutting-edge research in areas such as signal processing and RF technology to deliver reliable products that meet the evolving needs of its customers across diverse markets.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

32 Patents

#57 in Milpitas, CA

#2,532 in California

#10,593 in US

#20,660 in the World

Milpitas, CA, United States of America

Avantek, Inc.

Forward Citations = 771

30 inventors:

Amarpal S Khanna (5 out of 8 patents)

Chang-Hwang Hua (5 out of 5 patents)

Simon S Chan (4 out of 62 patents)

4. Ding-Yuan S Day (4 out of 4 patents)

5. Issy Kipnis (2 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Avantek, Inc.. Retrieved from https://idiyas.com/company/avantek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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