For the Inventor, By the Inventor

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Pittsburgh, PA, United States of America

Arieca Inc.

USPTO Granted Patents = 4

EPO Patents = 2

Trademarks = 3

Forward Citations = 8

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9 inventors (with patents filed for the assignee):

Navid Kazem (4 out of 7 patents)

Carmel Majidi (2 out of 39 patents)

Dylan S Shah (2 out of 2 patents)

4. Jeffrey Gelorme (1 out of 1 patent)

5. Hing Jii Mea (1 out of 1 patent)

6. Keyton D Feller (1 out of 1 patent)

7. Vivek Singh (1 out of 1 patent)

8. Allyssa Kerr (1 out of 1 patent)

9. Loren Russell (1 out of 1 patent)

4 patents: Sort by Forward Citations

1. 12700119 - Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assembly (2026-08-04),

2. 12027442 - Thermal interface material, an integrated circuit formed therewith, and a method of application thereof (2024-07-02),

3. 11335622 - Method, apparatus, and assembly for thermally connecting layers (2022-05-17),

4. 10777483 - Method, apparatus, and assembly for thermally connecting layers (2020-09-15),

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USPTO Data Jan 1 1976 - Sep 15 2026

4 Patents

#314 in Pittsburgh, PA

#2,211 in Pennsylvania

#60,501 in US

Pittsburgh, PA, United States of America

Arieca Inc.

Forward Citations = 8

9 inventors:

Navid Kazem (4 out of 7 patents)

Carmel Majidi (2 out of 39 patents)

Dylan S Shah (2 out of 2 patents)

4. Jeffrey Gelorme (1 out of 1 patent)

5. Hing Jii Mea (1 out of 1 patent)

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