The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Jun. 21, 2024
Arieca Inc., Pittsburgh, PA (US);
Loren Russell, Pittsburgh, PA (US);
Dylan S. Shah, Pittsburgh, PA (US);
Navid Kazem, Pittsburgh, PA (US);
ARIECA INC., Pittsburgh, PA (US);
Abstract
Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assembly are provided. The method comprises capturing, by a sensor, third three-dimensional data of the circuit assembly. The third three-dimensional data corresponds to a first region of a first component and a first region of a second component. Data corresponding to a second region of the first component and at least a portion of the first region of the second component are not present in the third three-dimensional data. The bond line parameter of the circuit assembly can be determined based on first three-dimensional data of the first component, second three-dimensional data of the second component, and the third three-dimensional data.