Company Filing History:
Years Active: 2024
Title: Innovations of Dylan S Shah
Introduction
Dylan S Shah is an accomplished inventor based in Pittsburgh, PA. He has made significant contributions to the field of thermal interface materials, showcasing his expertise and innovative spirit. His work is particularly notable for its application in integrated circuits.
Latest Patents
Dylan holds a patent for a thermal interface material, an integrated circuit formed therewith, and a method of application thereof. This innovative thermal interface material comprises 5% to 30% by volume of a polymer component and at least 70% by volume of liquid metal droplets. The polymer component includes a first polymer with a molecular weight ranging from 400 g/mol to 400,000 g/mol. The liquid metal droplets are effectively dispersed throughout the polymer component, enhancing the material's performance.
Career Highlights
Dylan is currently employed at Arieca Inc., where he continues to develop cutting-edge technologies. His work at the company reflects his commitment to advancing thermal management solutions in electronic devices.
Collaborations
Dylan collaborates with talented individuals such as Jeffrey Gelorme and Navid Kazem, contributing to a dynamic and innovative work environment.
Conclusion
Dylan S Shah's contributions to the field of thermal interface materials exemplify his innovative approach and dedication to technology. His patent and ongoing work at Arieca Inc. highlight his role as a significant inventor in the industry.