The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Dec. 01, 2023
Applicant:

Arieca Inc., Pittsburgh, PA (US);

Inventors:

Jeffrey Gelorme, Burlington, CT (US);

Navid Kazem, Pittsburgh, PA (US);

Keyton D. Feller, Pittsburgh, PA (US);

Hing Jii Mea, Pittsburgh, PA (US);

Dylan S. Shah, Pittsburgh, PA (US);

Allyssa Kerr, Pittsburgh, PA (US);

Vivek Singh, Pittsburgh, PA (US);

Assignee:

ARIECA INC., Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C08K 3/08 (2006.01); C08L 71/02 (2006.01); C09K 5/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3733 (2013.01); C08K 3/08 (2013.01); C08L 71/02 (2013.01); C09K 5/063 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); C08K 2201/001 (2013.01); C08L 2203/20 (2013.01); C08L 2312/00 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29301 (2013.01); H01L 2224/29305 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/0108 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/061 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/095 (2013.01);
Abstract

A thermal interface material, an integrated circuit formed therewith, and a method of application thereof are provided. The thermal interface material includes 5% to 30% by volume of a polymer component and at least 70% by volume of liquid metal droplets, all based on total volume of the thermal interface material. The polymer component has a first polymer having a molecular weight in a range of 400 g/mol to 400,000 g/mol. The liquid metal droplets are dispersed throughout the polymer component.


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