Company Filing History:
Years Active: 2024
Title: Innovations of Hing Jii Mea in Thermal Interface Materials
Introduction
Hing Jii Mea is an accomplished inventor based in Pittsburgh, PA, known for his significant contributions to the field of thermal interface materials. With a focus on enhancing the performance of integrated circuits, he has developed innovative solutions that address critical challenges in thermal management.
Latest Patents
Hing Jii Mea holds a patent for a thermal interface material, an integrated circuit formed therewith, and a method of application thereof. This patent describes a thermal interface material that comprises 5% to 30% by volume of a polymer component and at least 70% by volume of liquid metal droplets. The polymer component includes a first polymer with a molecular weight ranging from 400 g/mol to 400,000 g/mol. The liquid metal droplets are effectively dispersed throughout the polymer component, enhancing the thermal conductivity and efficiency of integrated circuits.
Career Highlights
Hing Jii Mea is currently employed at Arieca Inc., where he continues to innovate and develop advanced materials for electronic applications. His work has positioned him as a key player in the field of thermal management solutions.
Collaborations
Hing Jii Mea collaborates with talented professionals such as Jeffrey Gelorme and Navid Kazem, contributing to a dynamic team focused on pushing the boundaries of material science and engineering.
Conclusion
Hing Jii Mea's innovative work in thermal interface materials exemplifies the importance of research and development in enhancing electronic performance. His contributions are paving the way for future advancements in the industry.