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Bedford, MA, United States of America

1366 Technologies Inc.

USPTO Granted Patents = 14

CIPO Patents = 15

EPO Patents = 7

Trademarks = 5

Forward Citations = 55

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42 inventors (with patents filed for the assignee):

Emanuel Michael Sachs (12 out of 90 patents)

Ralf Jonczyk (8 out of 13 patents)

Richard Lee Wallace, Jr (6 out of 13 patents)

4. Adam M Lorenz (5 out of 8 patents)

5. G D Stephen Hudelson (5 out of 5 patents)

6. Holly G Gates (4 out of 34 patents)

7. Eerik Torm Hantsoo (3 out of 11 patents)

8. Benjamin F Polito (3 out of 22 patents)

9. Brian Kernan (2 out of 10 patents)

10. Peter E Kane (2 out of 3 patents)

11. Andrew M Gabor (2 out of 2 patents)

12. Gd Stephen Hudelson (1 out of 1 patent)

13. Guy Danner (1 out of 66 patents)

14. Damian W Harris (1 out of 1 patent)

15. Hector A Inirio (1 out of 2 patents)

14 patents: Sort by Forward Citations

1. 10770613 - Methods for creating a semiconductor wafer having profiled doping and wafers and solar cell components having a profiled field, such as drift and back surface (2020-09-08),

2. 10633765 - Method for maintaining contained volume of molten material from which material is depleted and replenished (2020-04-28),

3. 10549476 - Methods and apparati for handling, heating and cooling a substrate upon which a pattern is made by a tool in heat flowable material coating, including substrate transport, tool laydown, tool tensioning and tool retraction (2020-02-04),

4. 10439095 - Methods for creating a semiconductor wafer having profiled doping and wafers and solar cell components having a profiled field, such as drift and back surface (2019-10-08),

5. 10072351 - Methods and apparati for making thin semi-conductor wafers with locally controlled regions that are relatively thicker than other regions and such wafers (2018-09-11),

6. 9815072 - Apparatus for depositing a thin layer of polymer resist on a substrate (2017-11-14),

7. 9643342 - Apparati for fabricating thin semiconductor bodies from molten material (2017-05-09),

8. 9425346 - Methods of imprint patterning of irregular surface (2016-08-23),

9. 9419167 - Making semiconductor bodies from molten material using a free-standing interposer sheet (2016-08-16),

10. 8696810 - Selected methods for efficiently making thin semiconductor bodies from molten material for solar cells and the like (2014-04-15),

11. 8669187 - Porous lift-off layer for selective removal of deposited films (2014-03-11),

12. 8633052 - Wedge imprint patterning of irregular surface (2014-01-21),

13. 8628992 - Methods to pattern diffusion layers in solar cells and solar cells made by such methods (2014-01-14),

14. 8293009 - Methods for efficiently making thin semiconductor bodies from molten material for solar cells and the like (2012-10-23),

1366 Technologies Inc. is a solar wafer manufacturing company that develops and commercializes innovative technologies to make solar energy more affordable and accessible. Their proprietary Direct Wafer™ process produces high-quality wafers with lower costs compared to traditional methods. The company aims to drive down the cost of solar energy and accelerate its widespread adoption worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

14 Patents

#42 in Bedford, MA

#1,315 in Massachusetts

#21,588 in US

#40,857 in the World

Bedford, MA, United States of America

1366 Technologies Inc.

Forward Citations = 55

42 inventors:

Emanuel Michael Sachs (12 out of 90 patents)

Ralf Jonczyk (8 out of 13 patents)

Richard Lee Wallace, Jr (6 out of 13 patents)

4. Adam M Lorenz (5 out of 8 patents)

5. G D Stephen Hudelson (5 out of 5 patents)

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