The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jan. 16, 2014
Applicants:

1366 Technologies, Inc., Bedford, MA (US);

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Benjamin F. Polito, Gorham, ME (US);

Holly G. Gates, Somerville, MA (US);

Emanuel M. Sachs, Newton, MA (US);

Assignees:

1366 Technologies Inc., Bedford, MA (US);

MASSACHUSETTS INSTITUTE OF TECHNOLOGY, Cambridge, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0236 (2006.01); G03F 7/00 (2006.01); B29C 59/02 (2006.01); B29C 43/36 (2006.01); H01L 31/18 (2006.01); B29C 43/02 (2006.01); B29C 43/22 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); B29C 43/46 (2006.01);
U.S. Cl.
CPC ...
H01L 31/182 (2013.01); B29C 43/021 (2013.01); B29C 43/222 (2013.01); B29C 59/02 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); H01L 31/0236 (2013.01); H01L 31/02363 (2013.01); B29C 2043/025 (2013.01); B29C 2043/3634 (2013.01); B29C 2043/3652 (2013.01); B29C 2043/465 (2013.01); B29C 2059/023 (2013.01); Y02E 10/50 (2013.01);
Abstract

Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired.


Find Patent Forward Citations

Loading…