The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Sep. 04, 2019
Applicant:

1366 Technologies Inc., Bedford, MA (US);

Inventors:

Ralf Jonczyk, Concord, MA (US);

Brian D. Kernan, Andover, MA (US);

G.D. Stephen Hudelson, Billerica, MA (US);

Adam M. Lorenz, Arlington, MA (US);

Emanuel M. Sachs, Newton, MA (US);

Assignee:

1366 TECHNOLOGIES INC., Bedford, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/06 (2012.01); H01L 31/00 (2006.01); H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); C30B 11/00 (2006.01); C30B 19/12 (2006.01); C30B 28/04 (2006.01); C30B 29/06 (2006.01); C30B 31/02 (2006.01); C30B 31/04 (2006.01); C30B 35/00 (2006.01); H01L 21/00 (2006.01); H01L 31/068 (2012.01); H01L 31/056 (2014.01); H01L 31/0216 (2014.01); H01L 31/0288 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1804 (2013.01); C30B 11/002 (2013.01); C30B 19/12 (2013.01); C30B 28/04 (2013.01); C30B 29/06 (2013.01); C30B 31/02 (2013.01); C30B 31/04 (2013.01); C30B 35/002 (2013.01); H01L 21/00 (2013.01); H01L 31/0288 (2013.01); H01L 31/02167 (2013.01); H01L 31/022425 (2013.01); H01L 31/056 (2014.12); H01L 31/068 (2013.01); H01L 31/182 (2013.01); Y02E 10/52 (2013.01); Y02E 10/546 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

A semiconductor wafer forms on a mold containing a dopant. The dopant dopes a melt region adjacent the mold. There, dopant concentration is higher than in the melt bulk. A wafer starts solidifying. Dopant diffuses poorly in solid semiconductor. After a wafer starts solidifying, dopant can not enter the melt. Afterwards, the concentration of dopant in the melt adjacent the wafer surface is less than what was present where the wafer began to form. New wafer regions grow from a melt region whose dopant concentration lessens over time. This establishes a dopant gradient in the wafer, with higher concentration adjacent the mold. The gradient can be tailored. A gradient gives rise to a field that can function as a drift or back surface field. Solar collectors can have open grid conductors and better optical reflectors on the back surface, made possible by the intrinsic back surface field.


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