Inventors: Nobuyuki Kaji, Hisato Yabuta
The method for fabricating a device using an oxide semiconductor involves two main steps. First, the oxide semiconductor is formed on a substrate. Then, the conductivity of the oxide semiconductor is altered by irradiating a specific region with an energy ray.
Inventors: Katsutoshi Takeda, Masao Isomura
On a substrate, a ZnO buffer layer is formed either with low electrical conductivity (≤ 1×10-9 S/cm) or with a different crystal face diffraction peak than (002) and (004) in X-ray diffraction, achieved through sputtering. On top of the ZnO buffer layer, a ZnO semiconductor layer is formed. The semiconductor layer is created with a lower flow rate of oxygen gas in the sputtering process compared to the ZnO buffer layer formation.
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